Reballing memory set to reach 7–9% of smartphones by 2027

Reused chips head for more phones

Smartphone makers are turning to salvaged memory chips as the cost of new components climbs, according to TechRadar. The research firm TrendForce estimates that reworked memory will appear in 3–4% of smartphones in 2026, rising to roughly 7–9% in 2027.

The practice, known as reballing, involves taking memory chips off existing circuit boards and preparing them for a second installation. It gives manufacturers a cheaper supply of parts at a time when mobile DRAM, the fast working memory inside a phone, is becoming more expensive to buy new.

TrendForce expects memory prices to rise faster in the first quarter of 2027. That would add to the pressure on brands that already face high production costs.

How reballing works

Memory chips sit on a phone's circuit board over a grid of tiny metal spheres made of solder. These spheres carry electrical signals between the chip and the board while keeping the component compact.

To reuse a chip, technicians remove the old solder, clean the contact surface and attach a fresh set of spheres of the right size. The chip can then be soldered onto another board.

Whether a recovered chip is fit for reuse depends on its condition, how it has been handled and the quality of the refurbishment work. Not every removed chip will pass those tests.

Budget phones feel the squeeze first

Most reclaimed chips so far are 4GB LPDDR4X modules, a type of older and slower memory, TrendForce says. Their use is concentrated in inexpensive 4G handsets priced below CNY 1,299, or about $195.

Buyers in this segment are highly sensitive to retail prices. Recovering usable parts rather than buying only newly made memory helps manufacturers limit component spending and hold down price rises for customers who cannot easily afford costlier models.

So far the practice stays in the budget tier. However, TechRadar reports that continued DRAM price increases could push makers to consider older or lower-specification parts in more expensive phones as well.

Quality and reliability questions remain

The savings come with technical risks. Manufacturers may struggle to guarantee consistent quality across chips sourced from different suppliers and refurbishment channels.

Repeated heating stresses electronic packages, and damaged contacts or imperfect replacement work can affect electrical performance once a chip is installed in a phone. Conventional reballing melts solder with heat, and component makers generally advise no more than three such heating cycles for a device.

Laser-based methods could reduce that exposure by concentrating heat on the solder contacts rather than warming the whole package. Even so, manufacturers must weigh immediate savings against possible later costs from failures, repairs, warranty claims and unhappy customers.

What it means for buyers and prices

Reclaimed memory is expected to remain a small share of the total low-power DRAM that smartphones consume each year. TrendForce therefore does not expect its growing use to reverse the upward movement in contract prices, because its contribution to overall demand is limited.

For readers, the practical effect is likely to be subtle. Phones in the budget range may keep their prices steadier for longer, but the presence of reworked chips raises fair questions about long-term durability that manufacturers have yet to answer in detail.